Title:
ELECTROPLATING METHOD FOR HORIZONTALLY LAID LOOP-SHAPED WIRE MATERIAL
Document Type and Number:
Japanese Patent JPS5723090
Kind Code:
A
Abstract:
PURPOSE:To electroplate the titled wire material continuously, uniformly, efficiently and keeping good adhesion of plating, by dividing and disposing anode electrodes into plural blocks in a plating tank and by controlling each feeding amount of every block to electroplate the wire material. CONSTITUTION:Among D.C. electric sources 35-49, variable resistances for controlling current 20-34, anode electrode plates 5-19, the horizontally laid loop wire rod 2 and anode feeding rollers 50, 51, each independent electric circuit is formed to control the feeding amount independently at each anode electrode of the electrodes 5-19. Considering that e.g. the electric resistance at a position of the material increases as the position is situated nearer the middle point of the plating tank, the feeding amount to each of the electrodes 5-19 is controlled so that the feeding amount to an electrode is increased gradually or stepwisely as the electrode is situated near to the middle point apart from the inlet and outlet of the plating tank. Thus, an optimum controlling pattern for providing a desired plating thickness is established, thereby enabling efficient electroplating. The process can provide a plated wire material having an uniform thickness of plating and a good color tone.
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Inventors:
TANAKA HARUTOSHI
KUMADA TADAMORI
KUMADA TADAMORI
Application Number:
JP9557480A
Publication Date:
February 06, 1982
Filing Date:
July 15, 1980
Export Citation:
Assignee:
NIPPON STEEL WELDING PROD ENG
International Classes:
C25D7/06; C25D5/00; (IPC1-7): C25D5/00