To provide a method capable of depositing an electroplating film excellent in appearance and physical properties on a nonconductive plastics by a simple treating process.

In this electroplating method for nonconductive plastics, by using a colloidal solution containing a noble metal compound and a primary tin compound, a catalyst for electroless plating is applied on nonconductive plastics, thereafter, by using an electroless copper plating solution containing at least one kind of polyhydric alcohol compound selected from ethylene glycol, glycerin and erythritol, a copper compound, a complex and alkali metal hydroxide, a conductive film is deposited, and then, electroplating is executed.