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Patent Searching and Data


Title:
ELECTROPLATING METHOD
Document Type and Number:
Japanese Patent JP2007211330
Kind Code:
A
Abstract:

To provide an electroplating method having reduced environmental influence for forming an electrically conductive metal layer on the surface of a planar or cubic insulator such as glass and ceramics.

The method for electroplating an electrically conductive metal layer on the surface of a planar or cubic insulator comprises: a step (a) where the surface of the insulator is coated with a graphite-dispersed liquid which comprises graphite particles with an average particle diameter of 0.05-20 μm in an amount of 1 to 20 mass%, a natural or synthetic organic matter or surfactant for dispersing the graphite particles into a water medium in an amount of 0.1 to 30 mass% to the graphite particles, and the water medium, and whose pH lies in the range of 5 to 12; a step (b) where the coated material on the insulator is dried to form a film mainly made up of the graphite particles; and a step (c) where, as an electrically conductive layer, a metal or an alloy is electroplated on the film.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
KUBOTA YOSHIHIRO
KOIDE AKIO
FRANK POLAKOVIC
SAITO TAKASHI
Application Number:
JP2006035403A
Publication Date:
August 23, 2007
Filing Date:
February 13, 2006
Export Citation:
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Assignee:
HITACHI POWDERED METALS
FM SCIENT LLC
International Classes:
C25D5/54; C23C28/00
Attorney, Agent or Firm:
Suenari Mikio