Title:
ELECTROPLATING METHOD
Document Type and Number:
Japanese Patent JPH05230688
Kind Code:
A
Abstract:
PURPOSE:To provide an electroplating method by which a uniform plating film is formed in the area to be plated without requiring a conducting part for electrically connecting the areas to be plated even though independent areas to be plated exist. CONSTITUTION:An electroplating method is provided so that an energizing electrode may be put on the surface to be treated of a body to be treated 1 where there are independent areas to be plated in the surface to be treated in a plating bath and simultaneously electroplating may be performed while a contact position of the energizing electrode to the surface to be treated is changed.
Inventors:
YOSHIZAWA IZURU
YAMAGUCHI NOBORU
YAMAGUCHI NOBORU
Application Number:
JP3536492A
Publication Date:
September 07, 1993
Filing Date:
February 21, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C25D5/02; C25D5/04; C25D7/00; H05K3/24; (IPC1-7): C25D5/02; C25D5/04; C25D7/00
Attorney, Agent or Firm:
Takehiko Matsumoto
Previous Patent: JPS5230687
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