Title:
電気めっき用金型およびその製造プロセス
Document Type and Number:
Japanese Patent JP7152232
Kind Code:
B2
Abstract:
A process for manufacturing a mould including: a) providing a first substrate made of photosensitive glass of thickness of at least equal to the height of the mould, b) illuminating the first substrate with UV rays through a mask the windows of which correspond to the depression of the mould in order to create illuminated zones, c) carrying out a heat treatment on the first substrate obtained in step b) in order to crystallize the illuminated zones, d) providing a second substrate having at least one conductive layer on its surface, e) joining the first substrate obtained in step c) with the second substrate so that the conductive layer is located between the first substrate and the second substrate, f) removing the illuminated and crystallized zones of the first substrate so as to uncover the conductive layer, forming a cavity with sidewalls and a bottom occupied by the conductive layer of the mould.
Inventors:
Marco Velard
Alex gandelman
Marcial Chabro
Pierre Cusan
Alex gandelman
Marcial Chabro
Pierre Cusan
Application Number:
JP2018176935A
Publication Date:
October 12, 2022
Filing Date:
September 21, 2018
Export Citation:
Assignee:
Nivalox-Far Society Anonym
International Classes:
C25D1/00
Domestic Patent References:
| JP2003200396A | ||||
| JP4269514A |
Foreign References:
| US20040241965 | ||||
| US20170287728 |
Other References:
J.Hormes,et.al.,“Materials for LiGA and LiGA-based microsystems”,Nuclear Instruments and Methods in Physics Research B,2003年,Vol.199,p.332-341
Attorney, Agent or Firm:
Shigeki Yamakawa
Yuzo Koike
Yuzo Koike
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