Title:
電解メッキ遮蔽板及びこれを有する電解メッキ装置
Document Type and Number:
Japanese Patent JP5763151
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electrolytic plating shield board capable of ameliorating the plating deviation and an electrolytic plating device possessing the same.SOLUTION: The provided electrolytic plating shield board comprises: a base shield panel through which many base through-holes are formed; and current magnitude adjustment members formed on both profile planes of the base shield panel for adjusting opening degrees of the base through-holes. The provided electrolytic plating device, furthermore, comprises: a cathode 10 to which a fixture and a substrate 20 are fixed; a nozzle pipe 30 for jetting a plating solution onto the substrate fixed to the cathode; an anode case on which a fitting hole scheduled to be fitted with the nozzle pipe is formed in a state where anode insertion units are being formed on both sides of the fitting hole; an anode 50 fitted into each anode insertion unit; a diaphragm configured contiguously to the anode insertion unit; a base shield panel through which multiple base through-holes are formed; and current magnitude adjustment members configured on both profile planes of the base shield panel for adjusting opening degrees of the base through-holes.
Inventors:
Han, Bon Hwan
Application Number:
JP2013229407A
Publication Date:
August 12, 2015
Filing Date:
November 05, 2013
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
C25D17/10; C25D17/00
Domestic Patent References:
| JP63176500A | ||||
| JP10130896A | ||||
| JP11246999A | ||||
| JP56033500A | ||||
| JP2145791A | ||||
| JP2010138433A | ||||
| JP2009293114A | ||||
| JP2000017496A |
Foreign References:
| US5776327 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation