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Title:
ELECTROSPRAY DEVICE
Document Type and Number:
Japanese Patent JP2016112504
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electrospray device capable of performing coating in such a manner as to suppress a reduction in solvent discharge quantity while restraining relatively large droplets from remaining.SOLUTION: An electrospray device 100 accumulates a solution material, which is sprayed from a nozzle 1, as a thin film on a base plate 200 by applying a voltage to the metal nozzle 1. The electrospray device 100 includes the nozzle 1 for spraying the solution material. A tip 11 of the nozzle 1 has a shape in which a diameter D1 of the nozzle 1 becomes smaller toward a tip 12.SELECTED DRAWING: Figure 1

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Inventors:
HASHIMOTO YASUNORI
HONDA KENSHIN
YAMAMOTO KIYOTO
HATAKEYAMA TATSUO
Application Number:
JP2014253103A
Publication Date:
June 23, 2016
Filing Date:
December 15, 2014
Export Citation:
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Assignee:
TORAY ENG CO LTD
International Classes:
B05B5/025; B05B1/02
Domestic Patent References:
JP2008149274A2008-07-03
JP4080893B22008-04-23
JP2008149274A2008-07-03
JP4080893B22008-04-23
JP2009043561A2009-02-26
JPS5034641A1975-04-03
JP2009262058A2009-11-12
JP2009043561A2009-02-26
JPS5034641A1975-04-03
JP2009262058A2009-11-12
Foreign References:
US6032876A2000-03-07
US20120138714A12012-06-07
US20130034594A12013-02-07
Attorney, Agent or Firm:
Hirokazu Miyazono



 
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