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Title:
ELECTROSTATIC ATTRACTION DEVICE AND ELECTRON BEAM PLOTTING APPARATUS USING IT
Document Type and Number:
Japanese Patent JP3373762
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain an electrostatic attraction device, by which an attraction defect and a grounding defect can be detected precisely, when a sample is attracted and held by an electrostatic force.
SOLUTION: In an electrostatic attraction device, a sample (a wafer) 1 is placed on a dielectric 2. When a DC voltage 4 is applied to a grounding electrode 7 at the sample 1 and an electrode 3 on the side of the dielectric 2, an electrostatic force is generated to the sample 1 and the dielectric 2, and the sample 1 is attracted onto the dielectric 2 by the electrostatic force. When the DC voltage 4 is applied, another electrode 8 which comes into contact with the sample 1 is connected to a resistance measuring circuit 9, a resistance of the electrode 8 and the electrode 7 is measured, and the grounding state of the sample 1 is judged. After that, the electrode 8 is connected to the side of a potential measuring circuit 10, and a surface potential on the sample 1 is measured when a DC voltage 13 is applied. Thereby, the grounding state of the sample 1 and the potential are checked.


Inventors:
Masaru Matsushima
Masahiro Tsunoda
Seishiro Sato
Kazunori Ikeda
Yoshimasa Fukushima
Application Number:
JP22606197A
Publication Date:
February 04, 2003
Filing Date:
August 22, 1997
Export Citation:
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Assignee:
株式会社日立製作所
International Classes:
G03F7/20; B23Q3/15; H01L21/027; H01L21/68; H01L21/683; H02N13/00; (IPC1-7): H01L21/68; B23Q3/15; G03F7/20; H01L21/027; H02N13/00
Domestic Patent References:
JP645214A
JP520331U
Attorney, Agent or Firm:
Katsuo Ogawa