To provide an electrostatic chuck system which can suitably suck a test substrate smaller than the chuck surface of an electrostatic chuck in a test of evaluating a vacuum film forming apparatus.
An electrostatic chuck system 110 includes an electrostatic chuck 50 including a dielectric layer 53 having an electrode 52 built therein and having a surface region of the dielectric layer 53 defined by the electrode 52 which functions as a chuck surface 54; a power source 51 applying voltage to the electrode 52; a first cover 61A which has small openings 62A smaller than the chuck surface 54 of the electrostatic chuck 50 and which covers the chuck surface 54 other than the openings 62A. The system is arranged so that, when a test substrate 63A having nearly the same shape as the opening 62A is located on the opening 62A, a voltage applied to the electrode 52 causes an electrostatic force between the test substrate 63A and the chuck surface 54 and the electrostatic force causes the test substrate 63A to be sucked onto the chuck surface 54.
TERAKURA ATSUHIRO
AKASHI DAISUKE
MARUNAKA MASAO
MIYAZAKI NORIAKI
TSUCHIYA TAKAYUKI
NISHIDA ETSURO
TAKEUCHI KIYOSHI
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