To provide an element package structure which has high reliability in vacuum sealing of an element.

A cover part 2 is joined with an upper side of a substrate 1, and an element 4 is housed in a space 3 surrounded by the substrate 1 and the cover part 2. A connection hole 5 connected to the space 3 is provided in the cover part 2, and an aperture part of the connection hole 5 is provided on an upper surface of the cover part 2. An underlying electrode film is formed in a region over an entire circumference of the aperture part of the connection hole 5 opened on the upper surface of the cover part 2, and a heat-melting material 8 is joined with the underlying electrode film so as to close the aperture part of the connection hole 5 by the heat-fusible material 8, thereby sealing the element 4 in the vacuum space 3. Before the aperture part of the connection hole 5 is closed by the heat-fusible material 8, evacuation of the space 3 is carried out, and the heat-fusible material 8 is heated and melted in the vacuum so as to wait for complete exhaust of gas from the heat-fusible material 8. After that, the heat-fusible material 8 on completion of evacuation is pressed and joined to the underlying electrode film on the periphery of the aperture part of the connection hole 5 so as to close the aperture part of the connection hole 5 by the heat-fusible material 8, thereby sealing the space 3 in the vacuum.