ELIMINATING METHOD OF RESIST FILM IMAGE AND PRESSURE-SENSITIVE ADHESIVE AGENT OR ADHESIVE SHEET THEREFOR

Title:

ELIMINATING METHOD OF RESIST FILM IMAGE AND PRESSURE-SENSITIVE ADHESIVE AGENT OR ADHESIVE SHEET THEREFOR

Document Type and Number:

Japanese Patent JPH06151301

Kind Code:

A

Abstract:

PURPOSE: To easily and surely eliminate an ion-implanted resist film image, by using a specified adhesive sheet.

CONSTITUTION: An adhesive sheet using pressure-sensitive adhesive agent containing water or hydrophilic compound which are turned into a microcapsule state is stuck on a resist film image on a semiconductor substrate which is preferably heated. Microcapsules in the adhesive agent expand and burst due to the heat, and the water or the hydrophilic compound comes into contact with the resist film image. Thereby the resist film image is swelled or the adhesion of the interface between the semiconductor substrate and the resist film image is decreased. Then the adhesive sheet is peeled. Hence the ion- implanted resist film image can be excellently eliminated from the semiconductor substrate, together with the adhesive sheet.

Inventors:

NAMIKAWA AKIRA
KIHARA YASUO
SAITO KIYOSHI
AIZAWA KAORU
SHIMODAN HIDEAKI

Application Number:

JP29882892A

Publication Date:

May 31, 1994

Filing Date:

November 09, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NITTO DENKO CORP

International Classes:

C09J5/00; C09J7/02; G03F7/42; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; C09J5/00; C09J7/02; G03F7/42

Previous Patent: Game machine

Next Patent: METHOD OF DECOLORING AND DYEING WOOD VENEER