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Title:
EMBOSSED PATTERN STAMPING DEVICE
Document Type and Number:
Japanese Patent JP3401749
Kind Code:
B2
Abstract:

PURPOSE: To provide an embossed pattern stamping device, which can stamp favorable quality pattern on members to be stamped such as paper leaves and the like under uniform pushing-down force and, at the same time, a plurality of kinds of pattern.
CONSTITUTION: At the embossed pattern stamping device 1 concerned, member to be stamped P is made possible to be inserted in a main body consisting of a pair of side pieces and a bottom piece and, at the same time, a cassette 8 equipped with a stamping female mold and a stamping male mold is detachably attached. Further, an operating mechanism part equipped with a pusher, which applys uniform pushing-down force to the stamping male mold of the cassette 8 in interlocking with the operation of an operating lever 42, and a cassette pushing-out mechanism part for pushing out the cassette 8 in the main body are also equipped at the device 1. Due to the above-mentioned constitution, favorable quality pattern can be stamped to the member to be stamped placed between the stamping male mold and the stamping female mold. At the same time, by changing cassettes, a plurality of kinds of pattern can be stamped to the member to be stamped. In addition, the cassette 8 is easily taken out.


Inventors:
Toru Hirano
Application Number:
JP25738392A
Publication Date:
April 28, 2003
Filing Date:
September 01, 1992
Export Citation:
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Assignee:
Midori Co., Ltd.
International Classes:
B31F1/07; (IPC1-7): B31F1/07
Domestic Patent References:
JP5627996U
JP5125764B1
Attorney, Agent or Firm:
Fujio Shimoyama