Title:
EMBOSSING PROCESSING METHOD OF FOAM SHEET AND DEVICE THEREOF
Document Type and Number:
Japanese Patent JPH01192523
Kind Code:
A
Abstract:
PURPOSE:To obtain an embossed foam of a uniform thickness displaying the maximum shock-absorbing properties and heat insulation properties with the smallest material, by a method wherein a flat roll whose external circumference is formed of a recessed roll and non-Hookean elastic body is arranged in close vicinity to a heating roll. CONSTITUTION:A foam sheet 1 of thermoplastic resin is softened by heating with a heating roll 3 and heater 4 and introduced into a space between a recessed roll 71 and flat roll 51. Although the foam sheet 1 is embossed by receiving a load, as a non-Hookean elastic body 61 forming the external circumference of the flat roll 51 possesses specific stress-distortion characteristics, compression stress of an elastic limit or higher is not extended to the foam sheet 1 and a thickness of a foam sheet 21 to which embossing processing has been performed is held almost uniform, hereupon. Therefore, nonuniform thickness is not generated on an embossed part and an embossed commodity of an ideal foam sheet displaying the maximum shock-absorbing properties and heat insulation properties is obtained with the minimum material.
Inventors:
NARITA YUTAKA
Application Number:
JP1936188A
Publication Date:
August 02, 1989
Filing Date:
January 28, 1988
Export Citation:
Assignee:
KAWAKAMI SANGYO KK
International Classes:
B29C51/26; B29C59/04; B29K105/04; B29L7/00; (IPC1-7): B29C51/26; B29C59/04; B29K105/04; B29L7/00
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