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Title:
EMULSION RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005015513
Kind Code:
A
Abstract:

To obtain an emulsion resin composition having a high nonvolatile content and excellent liquid feeding properties, coating properties, water resistance and film-forming properties.

This emulsion resin composition comprises an emulsion mixture (C) of an emulsion (A) obtained by carrying out emulsion polymerization of vinyl monomers and having 0.1-0.3 μm volume-average particle diameter and an emulsion (B) prepared by carrying out the emulsion polymerization of vinyl monomers and having a volume-average particle diameter which is 10-80% of the volume-average particle diameter of the emulsion (A) in (100/0.1) to (100/10) nonvolatile content weight ratio (A)/(B). Furthermore, the resin composition has 20,000 to 150,000 weight-average molecular weight, 40-70 wt.% nonvolatile content and 2-5 ratio of the viscosity at 6 rpm number of revolutions to the viscosity at 60 rpm number of revolutions (viscosity at 6 rpm/viscosity at 60 rpm) in a BM type viscometer.


Inventors:
OKADA YASUO
YOSHIMURA HISAHIRO
Application Number:
JP2003177921A
Publication Date:
January 20, 2005
Filing Date:
June 23, 2003
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J3/05; C08L25/14; C08L57/00; C09D5/02; C09D125/14; C09D133/06; (IPC1-7): C08L57/00; C08J3/05; C08L25/14; C09D5/02; C09D125/14; C09D133/06