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Title:
封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置
Document Type and Number:
Japanese Patent JP4782279
Kind Code:
B2
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Inventors:
Katsuya Ouchi
Toshihiko Okamoto
Harumi Sakamoto
Application Number:
JP2000394823A
Publication Date:
September 28, 2011
Filing Date:
December 26, 2000
Export Citation:
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Assignee:
Kaneka Corporation
International Classes:
C08L83/05; C09K3/10; C08K5/00; C08L9/00; H01L23/29; H01L23/31
Domestic Patent References:
JP10212413A
JP11323030A
JP6192482A
JP11124502A
Attorney, Agent or Firm:
Atomi International Patent Office
Yasuo Yasutomi
Shinya Furuya



 
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