Title:
SEALANT FOR OPTICAL SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021181547
Kind Code:
A
Abstract:
To provide a sealant for optical semiconductor elements, capable of being formed into a cured product excellent in transparency through tabletting at a high yield.SOLUTION: The sealant for optical semiconductor element includes a semi-cured product (1) of an epoxy compound (A) containing at least a compound having two or more epoxy groups made of two neighboring carbon atoms constituting an aliphatic ring and an oxygen atom, and a carboxylic acid anhydride (B) having an alicyclic skeleton, and a particle (C) having the following characteristics. [Particle (C)] particle size: 0.01 to 10 μm, refractive index for light with a wavelength of 587.56 nm: 1.47 to 1.55.SELECTED DRAWING: None
Inventors:
HIRAKAWA HIROYUKI
YAMAMOTO YASUO
YAMAMOTO YASUO
Application Number:
JP2020088214A
Publication Date:
November 25, 2021
Filing Date:
May 20, 2020
Export Citation:
Assignee:
DAICEL CORP
International Classes:
C08G59/42; C08K5/09; C08K5/1515; C08K5/3445; C08K5/524; C08L101/02; H01L23/29; H01L23/31; H01L33/56
Attorney, Agent or Firm:
Goto Patent Office