Title:
封止用樹脂組成物及び電子部品装置
Document Type and Number:
Japanese Patent JP5776464
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To economically provide a sealing resin composition having well-balanced soldering resistance and curability with extremely reduced voids within a package while further improving flow property, and a semiconductor device with excellent reliability using the same.SOLUTION: The sealing resin composition includes: an epoxy resin (A); a phenolic resin curing agent (B) including a phenolic resin curing agent (b1) represented by general formula (1) and a phenolic resin curing agent (b2) represented by general formula (2); an inorganic filler (C); and a hardening accelerator (D). The electronic component device includes an element sealed with the sealing resin composition.
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Inventors:
Naoki Tomita
Masahiro Wada
Masahiro Wada
Application Number:
JP2011204003A
Publication Date:
September 09, 2015
Filing Date:
September 20, 2011
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/62; C08K5/54; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2011178923A |