Title:
Encapsulating resin composition and electronic component equipment
Document Type and Number:
Japanese Patent JP6322966
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a sealing resin composition which has sufficient adhesion and is used to obtain an electronic component device having high high-temperature storage characteristics, and to provide an electronic component device obtained by using as a sealing material such a sealing resin composition.SOLUTION: The sealing resin composition of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by formula (1). In the formula (1), Ris a polar group or a hydrocarbon group and is preferably a hydroxy group, an alkoxy group, or a primary, secondary or tertiary amino group. In an electronic component device 10 of the present invention which has an electronic component 11 and a sealing material 12 for sealing the electronic component 11, the sealing material 12 is a cured product of the sealing resin composition.
Inventors:
Yu Nakao
Hiroshi Kuroda
Hiroshi Kuroda
Application Number:
JP2013238415A
Publication Date:
May 16, 2018
Filing Date:
November 19, 2013
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L63/00; C08K5/205; H01L23/29; H01L23/31
Domestic Patent References:
| JP201146866A | ||||
| JP201567618A | ||||
| JP201377622A | ||||
| JP20072170A | ||||
| JP2013159746A |
Attorney, Agent or Firm:
Shinji Hayami