Title:
ENCAPSULATING STRUCTURE FOR CERAMIC ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP2001332401
Kind Code:
A
Abstract:
To provide an encapsulating structure for ceramic electronic parts which can satisfy both the moisture resistance and flame resistance required for the structure.
The encapsulating layer 3 of ceramic electronic parts is constituted to have a first resin layer 1 which is arranged to cover the surface of a ceramic elemental body 12 and composed of a non-flame-resistant epoxy resin having a superior moisture resistance and a flame-resistant resin layer 2 which is arranged on the first resin layer 1 as a second or after second intermediate layer or the outermost layer and composed of a flame-resistant epoxy resin.
Inventors:
KAWASHIMA ATSUSHI
KISHI MASAYOSHI
NARAI KEIICHI
KISHI MASAYOSHI
NARAI KEIICHI
Application Number:
JP2000148230A
Publication Date:
November 30, 2001
Filing Date:
May 19, 2000
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
C08K3/02; C08K5/521; C08L63/00; H01C1/032; H01G4/224; (IPC1-7): H01C1/032; C08K3/02; C08K5/521; C08L63/00; H01G4/224
Attorney, Agent or Firm:
Nishizawa Hitoshi