Title:
ENCAPSULATION MATERIAL COMPOSITION
Document Type and Number:
Japanese Patent JP2022071055
Kind Code:
A
Abstract:
To provide an encapsulation material composition which effectively blocks moisture or oxygen introduced into an organic electronic device from the outside and thus can secure a lifespan of the organic electronic device, and a method for manufacturing the same.SOLUTION: A method for manufacturing an encapsulation material composition includes a moisture removal stage including the injection of an inert gas of 20-5,000 lpm (liter per minute) into the encapsulation material composition inside a container, wherein the moisture removal stage is carried out at a fixed temperature.SELECTED DRAWING: Figure 1
Inventors:
CHOI KOOK-HYUN
KIM JUNG HYUN
WOO YU-JIN
YU MI-LIM
KIM JUNG HYUN
WOO YU-JIN
YU MI-LIM
Application Number:
JP2022030015A
Publication Date:
May 13, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
LG CHEMICAL LTD
International Classes:
C09K3/10; C08G59/24; C08G65/18; H01L51/50; H05B33/04
Domestic Patent References:
| JP2005135735A | 2005-05-26 | |||
| JP2010018797A | 2010-01-28 | |||
| JP2007169337A | 2007-07-05 |
Foreign References:
| WO2014017524A1 | 2014-01-30 | |||
| WO2015111635A1 | 2015-07-30 | |||
| WO2016167347A1 | 2016-10-20 | |||
| WO2017051795A1 | 2017-03-30 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation
Previous Patent: JPWO2022071054
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