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Title:
ENCAPSULED PART OF INTEGRATED MICRO ELECTROMECHANICAL SYSTEM AND MANUFACTURING PROCESS OF PART
Document Type and Number:
Japanese Patent JP2006095681
Kind Code:
A
Abstract:

To provide a method of preventing a plastic film from being hung down by weight in sealing a micro system using plastics.

This micro system 2 is integrated in a first cavity 3 formed by at least substrates 4, 6 and at least a part 8a of a first cover and bordering on an upper wall 7. The encapsuled part 1 has a second cavity 9 at least bordering on the whole of the upper wall of the first cavity 3 and a second cover 10 formed of a thin layer. The second cover 10 is covered with a film 11 made of plastic material, which is formed by casting. The manufacturing process of the encapsuled part 1 includes the steps of depositing layer of polymer material on the upper wall 7 of the first cavity 3, annealing the same to form a projecting sacrifical layer, depositing a thin film on the sacrifical layer, and removing the sacrifical layer to form a projecting second cover 10. A plastic film 11 is obtained by casting plastic material on the second cover 10.


Inventors:
DELAPIERRE GILLES
Application Number:
JP2005270815A
Publication Date:
April 13, 2006
Filing Date:
September 16, 2005
Export Citation:
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Assignee:
COMMISSARIAT ENERGIE ATOMIQUE
International Classes:
B81C99/00
Domestic Patent References:
JPH10281862A1998-10-23
JP2002277484A2002-09-25
JP2005250450A2005-09-15
JP2005262382A2005-09-29
JPH09148467A1997-06-06
JP2000040585A2000-02-08
JP2000268955A2000-09-29
JP2002365153A2002-12-18
JP2003051561A2003-02-21
Foreign References:
US20040166606A12004-08-26
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki