Title:
ENCLOSURE FOR ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2022147498
Kind Code:
A
Abstract:
To provide an enclosure for electronic equipment capable of efficiently conducting generated heat to the outside.SOLUTION: An enclosure for electronic equipment includes: a main body part that encloses electronic devices that generate heat due to the drive; and a back face member that is provided on a back face side of the main body part and connected to a rail member. The back face member has a contact surface portion configured to extend inside the main body part to be in direct or indirect contact with a surface of the electronic devices installed inside the main body part. The back face member is composed of a material with higher thermal conductivity than a member for installing the electronic equipment.SELECTED DRAWING: Figure 1
Inventors:
SAKO HIROYUKI
ZHENG WANG
OKUNO TOMOYA
KOMIYA TOMONORI
KAWASHIMA YOSHIHIDE
ZHENG WANG
OKUNO TOMOYA
KOMIYA TOMONORI
KAWASHIMA YOSHIHIDE
Application Number:
JP2021048760A
Publication Date:
October 06, 2022
Filing Date:
March 23, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K7/20; H05K5/02
Attorney, Agent or Firm:
Patent business corporation glory patent office