Title:
END FACE PROCESSING METHOD AND END FACE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2014053510
Kind Code:
A
Abstract:
To provide an easily controllable end face processing method and an end face processing device of a plate-like member without pinching a debris between a surface protective material and the plate-like member.
The end face processing method includes a process of removing a part containing an edge by evaporation by irradiating a laser beam with which an absorption rate by a plate-like member is higher than that by a surface protective material at a part containing the edge of the plate-like member to one surface of which the surface protective material is bonded.
More Like This:
Inventors:
YAMASHITA DAISUKE
Application Number:
JP2012197939A
Publication Date:
March 20, 2014
Filing Date:
September 07, 2012
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K26/00; H01L21/304; B23K26/08; B23K26/082; B23K26/36
Attorney, Agent or Firm:
Masahiko Hinataji
Previous Patent: ELECTRONIC APPARATUS UNIT AND ELECTRONIC APPARATUS
Next Patent: SILICON CARBIDE SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Next Patent: SILICON CARBIDE SEMICONDUCTOR DEVICE MANUFACTURING METHOD