Title:
HEAT-ABSORPTIVE COOLING MECHANISM, AND HEAT-ABSORPTIVE CORPSE COOLING DEVICE
Document Type and Number:
Japanese Patent JP2018099329
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-absorptive cooling mechanism which can sufficiently improve a cooling effect by efficiently conducting heat of an object to be cooled smoothly.SOLUTION: A heat-absorptive cooling mechanism CL includes: a heat conductive member 110 that contacts and supports an object to be cooled from bottom; a thermal electronic cooling unit (130) having a thermal electronic cooling element (131) and having a heat-absorptive side which is in contact with a heat conducting member 110; and a heat sink 140 which is in contact with a heat generating side of the thermal electronic cooling unit (130). The heat conductive member 110 includes a contact part 111 which extends in a horizontal direction and which comes into contact with the object to be cooled, and a supporting part 112 which extends downwardly from the contact part 111 so as to form a T-shape. When view from front of the T-shape, a width W1 of an upper part 112a of the supporting part 112 is made larger than a width W2 of a lower part 112b of the supporting part 112.SELECTED DRAWING: Figure 4
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Inventors:
KAWAMOTO KAZUO
Application Number:
JP2016247223A
Publication Date:
June 28, 2018
Filing Date:
December 20, 2016
Export Citation:
Assignee:
KAWAMOTO KAZUO
International Classes:
A61G17/04; F25B21/02; F25D11/00; F25D19/00
Domestic Patent References:
| JP2008263860A | 2008-11-06 | |||
| JP2006207935A | 2006-08-10 | |||
| JP2009011574A | 2009-01-22 | |||
| JPH0994275A | 1997-04-08 | |||
| JP2004261199A | 2004-09-24 |
Attorney, Agent or Firm:
Takashi Harada