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Title:
ENERGIZATION CIRCUIT PROTECTION DEVICE
Document Type and Number:
Japanese Patent JP2013229965
Kind Code:
A
Abstract:

To provide an energization circuit protection device, capable of intercepting a conduction circuit by securely detecting heating in a circuit for controlling to drive a load by PWM driving a semiconductor switch.

When driving a load RL by PWM driving a semiconductor device 11 disposed in a circuit for connecting the load RL to a power supply VB, if a current flowing through the load RL exceeds a threshold temperature, the semiconductor device 11 is switched from PWM drive to DC drive. Thus, in the event of an overcurrent, an estimated temperature by temperature estimation means exceeds the threshold temperature and the semiconductor device 11 is intercepted, so that the energization circuit can surely be protected.


Inventors:
UEDA KEISUKE
MARUYAMA AKINORI
NAKAMURA YOSHIHIDE
IKUTA YOSHINORI
Application Number:
JP2012000098899
Publication Date:
November 07, 2013
Filing Date:
April 24, 2012
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H02H5/04
Domestic Patent References:
JP2009226984A2009-10-08
JP2010172191A2010-08-05
JP2009226984A2009-10-08
JP2010172191A2010-08-05
Foreign References:
WO2010140474A12010-12-09
WO2010140474A12010-12-09
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu