封書作成装置 - Toppan Forms Co., Ltd.

Title:

封書作成装置

Document Type and Number:

Japanese Patent JP3987339

Kind Code:

B2

Abstract:

To decrease a possibility of opening the top and bottom parts of an envelope after heat fusion when the top and bottom parts of the envelope consisting of a film sheet are to be bonded by the heat fusion.

A pressing part 70 for pressing the top and bottom parts of the envelope 1 cut into a letter and fused by heat at a cutting part 40 to a conveyor 60b is provided.

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Inventors:

Takashi Tanaka
Yoneyama Takahiro
Yoshiaki Minami

Application Number:

JP2001387943A

Publication Date:

October 10, 2007

Filing Date:

December 20, 2001

Export Citation:

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Assignee:

Toppan Forms Co., Ltd.

International Classes:

B42D15/08; B31B50/10; B31B50/16; B31B50/64; B65B9/06; B65B9/067; B65B25/14; B65B51/10; B65B51/18; B65B51/32; B65D27/00

Domestic Patent References:

JP11227783A
JP59140824U
JP2001335010A
JP43000100Y1
JP7010112A

Attorney, Agent or Firm:

Akio Miyazaki
Shinichi Iwata
Masaaki Ogata
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki

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