Title:
ENVELOPE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021138385
Kind Code:
A
Abstract:
To provide a manufacturing method which can easily manufacture an envelope which can be sealed even for an article having a thickness.SOLUTION: There is provided a manufacturing method of an envelope 1 formed from a piece of corrugated board sheet 10 having a surface panel part 2, a back surface panel part 3 connected via a lower folding line a of the surface panel part 2, and a pair of side attachment parts 4, 4 connected to left and right side edges of the back surface panel part 3 via a side folding line b respectively. The surface panel part 2 has a gusset forming part 22 having a plurality of inclined fold lines 23 extending obliquely, and an unprocessed part 21 in which the inclined fold line 23 is not formed in a direction orthogonal to the lower fold line a from an upper edge of the surface panel part 2 to a lower edge. The manufacturing method includes a first bending process which bends the surface panel part 2 toward the back surface panel part 3 along the lower fold line a, a second bending process which bends the side attachment part 4 toward the back surface panel part 3 along the side fold line b, and an attachment process which attaches the surface panel part 2 to the side attachment part 4.SELECTED DRAWING: Figure 3
Inventors:
TAKANASHI TAKAYUKI
IWAKI KAZUNORI
NISHIGUCHI MAMORU
OKANO HIROTO
IWAKI KAZUNORI
NISHIGUCHI MAMORU
OKANO HIROTO
Application Number:
JP2020035717A
Publication Date:
September 16, 2021
Filing Date:
March 03, 2020
Export Citation:
Assignee:
TOMOKU CO LTD
International Classes:
B31B70/26; B65D27/00; B31B70/62
Attorney, Agent or Firm:
Creation International Patent Office