To easily provide an envelope with bottom paste processing only by applying paste to an overlap width without executing processing for linearly applying paste or the like to the inside of a bag body to allow it to be bonded.

In the envelope, a flap is extended at the upper side of a bag body surface, an overlap width short side is extended at the lower side, an overlap width long side is extended at the right side, and a bag body rear surface is extended at the left side. The bag body surface and the bag body rear surface are folded with a left folding strip as a fold. The bag body rear surface and the overlap width long side folded with a right folding strip as a fold are bonded to form a cylindrical body, the overlap width short side and the bag body surface are folded with a lower folding strip as a fold, and the bag body rear surface and the overlap width short side are bonded to form a bag-like body. A cutout is arranged at the lower part of the bag body rear surface, the upper and lower and left and right widths of the cutout are respectively smaller than the upper and lower and left and right widths of the overlap width short side, and the left end of the cutout is cut out from the left end the bag body rear surface to a part before reaching the left folding strip.