To obtain an epoxy compound useful as an adhesive, a coating material, an electric and electronic material for insulating materials, laminates, etc., especially a resin for semiconductor sealing and having high heat resistance.

This epoxy compound has preferably ≥0.05 poise and ≤3 poise melt viscosity at 150°C and includes, e.g. diglycidyl ether dimer of 4,4'- dihydroxy-3,3',5,5'-tetramethyl-α-methylstilbene. The epoxy compound is obtained by reacting chloroacetone with phenols and subjecting the reaction product to dehydrochlorination reaction to produce a substance containing a tetrakisphenol compound and converting the resultant compound to the corresponding glycidyl ether compound. The resultant epoxy compound and a epoxy curing agent are included or the epoxy compound, the epoxy curing agent and an epoxy compound represented by the formula (R1 to R9 are each 1-6C alkyl, phenyl or a halogen) are included to prepare the objective epoxy resin composition.