To provide a new epoxy compound that has a low melting point and can be a raw material of an epoxy resin cured product.

The epoxy compound is represented by formula (1) (wherein R1, R2, R3and R4are the same or different and are each a hydrogen atom, a halogen atom, a 1-8C alkyl group, a 1-8C alkoxy group, a cyano group or a nitro group; X1is a branched chain 2-18C alkylene group, and one of the branched chain 2-18C alkylene groups or at least two carbon-carbon single bonds may be replaced by an oxygen atom; X2is a straight chain or branched chain 1-18C alkylene group, and one of the straight chain or branched chain 1-18C alkylene groups or at least two carbon-carbon single bonds may be replaced by an oxygen atom).

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