Title:
エポキシ化合物、フェノール性水酸基含有化合物、硬化性組成物、その硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化樹脂成形品
Document Type and Number:
Japanese Patent JP6394941
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy compound that has excellent flowability and provides a cured product having excellent heat resistance, and a phenolic hydroxyl group-containing compound, a curable composition and a cured product thereof, a semiconductor sealant, a semiconductor device, a prepreg, a circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material, and a fiber-reinforced resin molding.SOLUTION: An epoxy compound has a molecular structure represented by formula (1) (where Rand Rindependently represent a C1-6 hydrocarbon group, a C1-6 alkoxy group, or an aryl group).
Inventors:
Ayumu Takahashi
Application Number:
JP2014122401A
Publication Date:
September 26, 2018
Filing Date:
June 13, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D303/27; C07C39/16; C08G59/32; C08J5/24; H05K1/03
Domestic Patent References:
| JP11130712A | ||||
| JP4304225A | ||||
| JP2000302945A | ||||
| JP59157114A | ||||
| JP6298902A |
Foreign References:
| WO2005000597A1 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi
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