Title:
Epoxy group content silicone resin, an epoxy group content silicone resin constituent, and its hardened material
Document Type and Number:
Japanese Patent JP6004581
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition which contains a block type siloxane compound being excellent in transparency and light resistance, having excellent heat resistance, and being very useful as an optical semiconductor printed wiring board.SOLUTION: A reactive functional group-containing block type siloxane compound is a block type siloxane oligomer comprising a silsesquioxane segment of reactive functional group-containing siloxane and a following silicone resin segment (SR), and having at least one epoxy group in the silsesquioxane segment.
Inventors:
Atsuhiko Hasegawa
Nakanishi Masataka
Nakanishi Masataka
Application Number:
JP2013061884A
Publication Date:
October 12, 2016
Filing Date:
March 25, 2013
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08G77/44; C08G59/20; C08K5/00; C08L83/10; H01L33/00
Domestic Patent References:
| JP201031149A |