PURPOSE: To prepare the title compsn. excellent in self-adhesive strength in temporary bonding before curing as well as in adhesive strength after curing by mixing a liq. epoxy resin, an adduct of an epoxy compd. with an imidazole compd., and fine silicone polymer particles.
CONSTITUTION: 100 pts.wt. epoxy resin which is liq. at room temp. (e.g. a bisphenol A epoxy resin), 1-60 pts.wt. adduct of an epoxy compd. (e.g. butyl glycidyl ether) with an imidazole compd. (e.g. 2-isopropylimidazole) as a curative, and 3-30 pts.wt. fine silicone polymer particles (e.g. fine polydimethylsiloxane particles) are mixed to give the title compsn. The compsn. cures quickly when heated and yet has an excellent storage stability because of the curative mixed; the polymer particles imparts cohesive strength to the compsn., enabling accurate positioning in temporary bonding.
YAMANAKA TAKESHI
OSHIMA TOSHIYUKI
