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Patent Searching and Data


Title:
EPOXY RESIN BASE COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JPH05193058
Kind Code:
A
Abstract:

PURPOSE: To provide the above composite material which can be molded by simple and rapid curing work, and is excellent in various characteristics such as strength, electric characteristics or the like.

CONSTITUTION: An epoxy resin compsn. containing a compound having at least one epoxy group, a compound having active hydrogen, a silicone compound having or generating a silanol hydroxyl group, an organometal compound, a maleimide compound, particulates and staple fibers is applied to or infiltrated in a sheet like base material composed of a fibrous material. This sheet like base material is dried by air and heated to be formed into a prepreg. Continuously, the prepregs are laminated and heated and/or irradiated with light to be cured.


Inventors:
SUZUKI SHUICHI
Application Number:
JP24096292A
Publication Date:
August 03, 1993
Filing Date:
September 09, 1992
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
B32B5/28; B32B27/04; B32B27/38; B64C1/00; B64G1/00; B64G1/10; C08G59/40; C08G59/68; (IPC1-7): B32B5/28; B32B27/04; B32B27/38; B64C1/00; B64G1/00; B64G1/10; C08G59/40; C08G59/68
Attorney, Agent or Firm:
Takehiko Suzue