PURPOSE: To obtain an epoxy resin-based molding material capable of suppressing corrosion in metal electrode, Al wiring, etc., when used for sealing up electronic parts, e.g., semiconductor elements, by adding a small amount of metaphosphoric acid(salt) or a polyphosphate to epoxy resin.
CONSTITUTION: An epoxy resin-based molding material is obtained by mixing 100pts.wt. epoxy resin, e.g., bisphenol A type epoxy resin (i), an epoxy curing agent (ii) e.g., phenol novolak resin, 150W400pts.wt. inorganic filler (iii), e.g., crystalline silica powder, quartz glass powder, etc., and 0.1pts.wt. or more metaphosphoric acid or its metal or ammonium salt or a metal salt of polyphosphoric acid by means of a mixer and then by melting and mixing the mixture by means of hot rolls, etc.
MATSUMOTO KAZUTAKA
YAEGASHI MITSUO
HATANAKA AYAKO
