Title:
EPOXY RESIN COMPOSITION, ADHESIVE, MOLDING MATERIAL AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2019218531
Kind Code:
A
Abstract:
To provide an epoxy resin composition that gives a cured product excelling in processability and a degree of freedom in blending, and excelling in adhesive strength, an adhesive and a molding material including the epoxy resin composition, and a cured product thereof.SOLUTION: An epoxy resin composition contains a (meth) acrylic copolymer (A), an epoxy resin (B) and a curing agent (C), the (meth) acrylic copolymer (A) having a macromonomer (a)-derived constitutional unit, and a vinyl monomer (b)-derived constitutional unit. A polymer obtained by polymerizing only the vinyl monomer (b) has a glass transition temperature (TgB) of 25°C or less.SELECTED DRAWING: None
Inventors:
MASUDA ERI
NAKAMURA JUNICHI
ODAKA KAZUYOSHI
TOMITA SORA
OTANI TAKESHI
NAKAMURA JUNICHI
ODAKA KAZUYOSHI
TOMITA SORA
OTANI TAKESHI
Application Number:
JP2018167110A
Publication Date:
December 26, 2019
Filing Date:
September 06, 2018
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L63/00; C08F290/04; C08L55/00; C09J133/00; C09J155/00; C09J163/00
Domestic Patent References:
| JP2008115239A | 2008-05-22 | |||
| JP2010243604A | 2010-10-28 | |||
| JP2005097435A | 2005-04-14 | |||
| JP2000298340A | 2000-10-24 | |||
| JP2020012092A | 2020-01-23 | |||
| JPH11349665A | 1999-12-21 | |||
| JP2017227883A | 2017-12-28 | |||
| JP2016196134A | 2016-11-24 |
Foreign References:
| WO2015080244A1 | 2015-06-04 | |||
| WO2007077888A1 | 2007-07-12 | |||
| WO2017057719A1 | 2017-04-06 |
Attorney, Agent or Firm:
Field Saki Satoshi
Shunsuke Fushimi
Kazunori Onami
Shunsuke Fushimi
Kazunori Onami