EPOXY RESIN COMPOSITION AND APPLICATION THEREOF

Title:

EPOXY RESIN COMPOSITION AND APPLICATION THEREOF

Document Type and Number:

Japanese Patent JP2002226552

Kind Code:

A

Abstract:

To provide an epoxy resin composition for a semiconductor sealing material excellent in low warpage, crack resistance and electrical properties for use in sealing a package of such a type as to hold semiconductor chips such as ball grid arrays on a resin substrate, to provide a cured product of the above composition, and to provide a semiconductor device using the above cured product.

This epoxy resin composition is characterized by comprising a curing promoter, an epoxy resin and a curing agent; wherein a phosphine oxide compound is the essential component for the curing promoter, the epoxy resin includes 5-100 wt.% of an epoxy resin of general formula (2), and the curing agent is a bifunctional or higher functional ester-containing compound or ester-containing resin where 10-100 mol% of the hydroxy groups are esterified with aromatic acyl groups.

Inventors:

URAKAWA TOSHIYA
MAEDA SUNAO
URAGAMI TATSUNOBU

Application Number:

JP2001030339A

Publication Date:

August 14, 2002

Filing Date:

February 07, 2001

Export Citation:

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Assignee:

MITSUI CHEMICALS INC

International Classes:

C08K3/00; C08G59/32; C08G59/40; C08K5/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; C08G59/32; C08K3/00; C08K5/00; C08L63/00; H01L23/29; H01L23/31

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