Title:
EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME
Document Type and Number:
Japanese Patent JP2014019868
Kind Code:
A
Abstract:
To provide an epoxy resin composition for a build-up insulating film which exhibits a low permittivity and a low dielectric tangent, an insulating film formed therefrom, and a multilayer printed circuit board having the same.
An epoxy resin composition for a build-up insulating film comprises: an epoxy resin (A); an acid anhydride curing agent (B) having a ratio of molar polarizability/molar volume of 0.6 or less and including a fluorine group or methyl group in a molecule thereof with a symmetric molecular structure; an inorganic filler (C); and a curing accelerator (D).
Inventors:
CHO JAE CHOON
JANG JONG YOON
LEE CHUNG HEE
CHUN HEE SUN
KIM SUNG HYUN
LEE CHOON KEUN
JANG JONG YOON
LEE CHUNG HEE
CHUN HEE SUN
KIM SUNG HYUN
LEE CHOON KEUN
Application Number:
JP2013121303A
Publication Date:
February 03, 2014
Filing Date:
June 07, 2013
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
C08G59/42; C08K3/00; C08K5/09; C08L63/00
Domestic Patent References:
| JPH0258527A | 1990-02-27 | |||
| JP2004256816A | 2004-09-16 | |||
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| JP2012177013A | 2012-09-13 | |||
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| JP2005290327A | 2005-10-20 | |||
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Foreign References:
| US6468659B1 | 2002-10-22 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike