EPOXY RESIN COMPOSITION, CURE PRODUCT, AND LAMINATED BOARD

Japanese Patent JP3537549

B2

PURPOSE: To obtain a cure product suppressed in lowering of heat resistance and adhesion with a high moisture resistance while having low dielectric properties and a low dielectric loss tangent by using (a) an epoxy resin obtd. by glycidylating a phenolated polybutadiene (co)oligomer, (b) a specific epoxy resin and (c) an isocyanate group-contg. compd. as the indispensable components.
CONSTITUTION: This epoxy resin compsn. comprises (a) an epoxy resin obtd. by glycidylating a phenolated polybutadiene (co)oligomer obtd. by addition of a phenol to a butadiene (co)oligomer, (b) an epoxy resin of formula I (wherein A is of formula II; X is of formula III; R is H, a halogen, or a 1-10C alkyl; G is glycidyl; (l) and (m) are each 1 to 2; and (n) is an integer of 0 or more), and (c) an isocyanate group-contg. compd. such as diisocyanatobenzene. The (a)/(b) blending ratio is 0.24 to 4.0. The amt. (z) of the component (c) is such that (x+y)/z is 0.3 to 3 wherein (x) is the amt. of the epoxy resins and (y) is the amt. of a curing agent.

JPH10225928	EPOXY RESIN COMPOSITION-IMPREGNATED SHEET
JP2002212536	ADHESIVE MEMBER AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR MOUNTING SEMICONDUCTOR COMPRISING THE ADHESIVE MEMBER AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE
JP5605853	A multilayer plastic substrate and a manufacturing method for the same

Kuboki, Kenichi
Akatsuka, Yasumasa
Shimamura, Yoshiro
Morita, Hiromi

JP18508595A

June 14, 2004

June 29, 1995

Click for automatic bibliography generation  

NIPPON KAYAKU CO LTD

B32B27/38; C08G59/20; C08G59/34; C08G59/40; C08G73/00; C08J5/24; C08L63/00; C08L79/04; H05K1/03; (IPC1-7): C08G59/20; C08J5/24; C08L63/00; C08L79/04

Previous Patent: EXHAUST DEVICE OF OUTBOARD MOTOR

Next Patent: CARBOXYL GROUP-CONTAINING POLYXYALKYLENE COMPOUND