Title:
EPOXY RESIN COMPOSITION, AND CURED PRODUCT OF THE SAME
Document Type and Number:
Japanese Patent JP2020122034
Kind Code:
A
Abstract:
To provide a non-halogen flame retardant epoxy resin composition excellent in heat resistance, CTI properties and dielectric properties in a cured product and a circuit board.SOLUTION: An epoxy resin composition contains an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin composition is such that: the epoxy resin includes a phosphorus-containing epoxy resin which is obtained by reacting a phosphorus-containing phenolic compound represented by the following formula (1) with a novolac type epoxy resin having a specific molecular-weight distribution as the essential components. (In the formula, Rand Rrepresent a C1-20 hydrocarbon group which may have a hetero element; Rand Rmay be bonded to form a cyclic structure; n1 and n2 are independently 0 or 1; and Y is C6-20 trivalent aromatic hydrocarbon group.)SELECTED DRAWING: None
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Inventors:
HOTTA YUKO
SATO HIROSHI
MIYAKE TSUTOMU
SATO HIROSHI
MIYAKE TSUTOMU
Application Number:
JP2019012703A
Publication Date:
August 13, 2020
Filing Date:
January 29, 2019
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
C08G59/14; B32B27/38; C08J5/24; C08K3/013; C08L63/00; H01B3/40; H01B17/56; H01L23/14; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005002294A | 2005-01-06 |
Foreign References:
| WO2013187184A1 | 2013-12-19 |
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse