Title:
EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRIC/ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2021147614
Kind Code:
A
Abstract:
To provide an epoxy resin composition which enables production of a cured product that has a small amount of hydrolyzable chlorine, and is excellent in electric characteristics and high temperature crack resistance, an epoxy resin composition further containing a curing agent, and a cured product of the same.SOLUTION: An epoxy resin composition (A) contains an epoxy resin represented by the following formula (1), and 4,4'-bishydroxy-3,3',5,5'-tetramethylbiphenyl diglycidyl ether. An epoxy resin composition (B) contains 0.01-1,000 pts.wt. of a curing agent with respect to 100 pts.wt. of the epoxy resin composition (A). In the formula, R1 is a linear aliphatic hydrocarbon group having 4 to 6 carbon atoms.SELECTED DRAWING: None
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Inventors:
OTA INSEI
Application Number:
JP2021037404A
Publication Date:
September 27, 2021
Filing Date:
March 09, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08G59/14; C08G59/24
Attorney, Agent or Firm:
Tsuyoshi Shigeno
Takayuki Shigeno
Takayuki Shigeno