To obtain the subject composition having excellent moisture resistance, IR-resistant reflowability, soldering heat resistance, moldability and high heat conductivity, not causing the separation of the sealed resin from a semiconductor chip, the generation of inner resin cracks, etc., and capable of insuring reliability for a long period by using a specific epoxy resin, a specific silane coupling agent and a specific filler.

This epoxy resin composition comprises (A) an anthracene type epoxy resin of formula I [R1-R4 are each CmH2m+1; (m) is an integer of 0 or ≥1), (B) a phenolic resin {for example, a compound of formula II [(n) is (m)]}, (C) a primary or secondary amine-based silane coupling agent of the formula: R5-CnH2n-Si(OR6)3 (R5 is an atomic group having an amino group; R6 is methyl or ethyl), (D) aluminum nitride powder having the maximum particle diameter of ≤100 μm, and (E) a curing accelerator, as essential components. The component D is compounded in an amount of 40-95 wt.% based on the total amount of the resin composition. The component E is preferably compounded in an amount of 0.01-5 wt.% based on the total amount of the resin composition.