Title:
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2010018668
Kind Code:
A
Abstract:
To provide an epoxy resin composition having excellent mold release properties and excellent package appearance and an electronic component apparatus equipped with an element sealed with an epoxy resin composition.
The epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) a release agent being an oxidized polyolefin-based wax compound produced by using a metallocene-based catalyst and (F) a compound containing one or more kinds of copolymers between an -olefin and at least one of maleic anhydride and a maleic anhydride derivative, as essential components. The electronic component apparatus is equipped with an element sealed using the epoxy resin composition.
Inventors:
NIITSU YOSHIHIRO
HAMADA MITSUYOSHI
NAGAI AKIRA
KATAYOSE MITSUO
HAMADA MITSUYOSHI
NAGAI AKIRA
KATAYOSE MITSUO
Application Number:
JP2008178981A
Publication Date:
January 28, 2010
Filing Date:
July 09, 2008
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L63/00; C08K3/00; C08L23/18; C08L23/30; C08L35/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2006104416A | 2006-04-20 | |||
| JP2005350500A | 2005-12-22 | |||
| JP2005325159A | 2005-11-24 | |||
| JP2001247748A | 2001-09-11 | |||
| JP2005225965A | 2005-08-25 | |||
| JP2006104416A | 2006-04-20 | |||
| JP2004224849A | 2004-08-12 |