Title:
EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE
Document Type and Number:
Japanese Patent JP2011179008
Kind Code:
A
Abstract:
To provide an epoxy resin composition excellent in curability in moisture absorption, fluidity and reflow crack resistance, and to provide electronic part devices mounted with elements sealed with the epoxy resin composition.
The epoxy resin composition essentially comprises (A) an epoxy resin, (B) a phenolic resin and (C) an addition reaction product of a quinone compound and a phosphine compound with at least one alkyl group bound to the phosphorus atom. The molded product obtained from the epoxy resin composition has a glass transition temperature of less than 155°C. The electronic part devices mounted with elements sealed with the epoxy resin composition are also provided.
Inventors:
NAKAMURA SHINYA
KATAYOSE MITSUO
MATSUI MEGUMI
KATAYOSE MITSUO
MATSUI MEGUMI
Application Number:
JP2011101505A
Publication Date:
September 15, 2011
Filing Date:
April 28, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/68; H01L23/29; H01L23/31
Domestic Patent References:
| JP2002080563A | 2002-03-19 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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