EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC PART DEVICE

Title:

EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC PART DEVICE

Document Type and Number:

Japanese Patent JP2007262385

Kind Code:

A

Abstract:

To provide an epoxy resin material for encapsulation which is free of halogen and antimony and good in flame retardancy, without lowering moldability, reflow resistance, moisture resistance and reliability of the high temperature shelf characteristics and the like, and to provide an electronic part device equipped with an element encapsulated with it.

The epoxy resin composition for encapsulation contains (A) an epoxy resin and (B) a compound represented by general formula (I) as a curing agent, wherein R1and R2indicate a hydrogen atom or a 1-10C substituted or unsubstituted monovalent hydrocarbon group; R3indicates a 1-8C alkyl or alkoxy group; n indicates an integer of 0-10 and m indicates an integer of 0-10, provided that m=n=0 is excepted.

Inventors:

IKEZAWA RYOICHI
AKAGI SEIICHI

Application Number:

JP2007037687A

Publication Date:

October 11, 2007

Filing Date:

February 19, 2007

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08G59/62; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu

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