PURPOSE: To prepare the titled composition for the encapsulation of transistor, IC, LSI, etc., giving little flash and having excellent moldability, by compounding a specific novolak epoxy resin with a novolak phenolic resin as a hardener, and a filler and a cure accelerator.
CONSTITUTION: The objective composition can be prepared by compounding (A) a novolak epoxy resin containing preferably 5W30wt% component having an epoxy equivalent of 170W300 and a molecular weight of ≥5,000 (preferably a cresol novolak epoxy resin having an epoxy equivalent of 180W220) with (B) a novolak phenolic resin (preferably the number of the phenolic hydroxyl group is one to one epoxy group in the resin A) as a hardener, (C) preferably 100W500pts.(wt.) of a filler (preferably silica or glass) per 100pts. of the resin A, and (D) a cure accelerator (e.g. triethanolamine).
ICHIMURA SHIGEKI
KUBO ETSUJI
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