Title:
EPOXY RESIN COMPOSITION, HEAT-CONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT RADIATION MATERIAL, LAMINATE, METAL SUBSTRATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2016023227
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition from which a cured product having high thermal conductivity can be formed, a heat-conducive material precursor from which a laminate having high thermal conductivity can be formed, a B-stage sheet and a prepreg, a heat radiation material having high thermal conductivity, a laminate, a metal substrate, and a printed wiring board.SOLUTION: The epoxy resin composition comprises boron nitride particles showing a half-width value 2θ of 0.5 degrees or less at a peak derived from (004) plane by X-ray diffraction analysis (XRD), a curing agent, and a liquid crystalline epoxy monomer represented by general formula (1) below. In general formula (1), X represents a single bond or a divalent connecting group; Y each independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, aliphatic alkoxy group having 1 to 8 carbon atoms, fluorine atom, chlorine atom, bromine atom, iodine atom, cyano group, nitro group, or acetyl group; n each independently represents an integer of 0 to 4; k represents an integer of 0 to 7; m represents an integer of 0 to 8; and l represents an integer of 0 to 12.SELECTED DRAWING: None
Inventors:
TAKEZAWA YOSHITAKA
YOSHIDA YUKA
SONG SHIHUI
TANAKA SHINGO
HOJO FUSAO
YOSHIDA YUKA
SONG SHIHUI
TANAKA SHINGO
HOJO FUSAO
Application Number:
JP2014148006A
Publication Date:
February 08, 2016
Filing Date:
July 18, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/24; B32B15/08; B32B15/092; C08J5/24; C08K3/22; C08K3/38; C08L63/00; H05K1/03; H05K1/05
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office