To obtain a heat-resistant epoxy resin composition useful for a laminated plate such as a print circuit board or a fiber reinforced composite material.

This epoxy resin composition is composed of (A) triglycidyl isocyanurate, (B) an epoxy resin having two epoxy groups or more in a molecule, (C) a novolac, (D) a hardening accelerator and (E) an aprotonic polar solvent. Further, (i) 0.4-4 pts.wt. of B is added to 1 pt.wt. of A, (ii) 0.85-1.1 equivalents of the hydroxyl group of the novolac of C is compounded with one equivalent of the epoxy group in the total of A and B and (iii) 0.0005-0.05 pt.wt. of D is compounded with one pt.wt. of the total of A and B.