To provide an epoxy resin composition which has a sufficient moisture resistance and does not injure its resin flowability or its resin strength after curing; and a hollow package prepared by using the composition and used for housing a semiconductor element.
The epoxy resin composition gives a cured resin having the following features: in an environment with a relative humidity of 100% at 121°C, the cured resin with a size of 50 mm × 50 mm × 1.5 mm has a saturated water absorption coefficient of 1 mass% or higher and the time from its dry state to its saturated water absorption state is 64 hours or longer. The composition contains at least one kind of epoxy resin selected from epoxy resins having a naphthalene ring structure and epoxy resins having a dicyclopentadiene structure, a curing agent composed of at least one kind of phenol resin selected from aralkylphenol resins, dicyclopentadiene type phenol resins, and naphthalene type phenol resins, a water-absorbing agent, and if necessary an inorganic filler.
KONDO MASAYUKI
KATO NAOYUKI
URAKAWA TOSHIYA
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| JP2001220496A | 2001-08-14 | |||
| JP2003160714A | 2003-06-06 | |||
| JP2001335677A | 2001-12-04 | |||
| JPH07315820A | 1995-12-05 | |||
| JP2004323644A | 2004-11-18 | |||
| JP2004331920A | 2004-11-25 | |||
| JP2001302885A | 2001-10-31 | |||
| JP2001302886A | 2001-10-31 |