EPOXY RESIN COMPOSITION AND INSULATION TREATMENT OF ELECTRIC INSTRUMENT USING THE SAME

Japanese Patent JP3932614

B2

PROBLEM TO BE SOLVED: To obtain the subject composition of two-pack type showing excellent casting workability, slight in filler precipitation in storage, capable of developing excellent nonconductivity, useful for insulating electric instruments, by using a component prepared by mixing a specific acid anhydride with a prescribed inorganic filler and a curing promoter.
SOLUTION: This epoxy resin composition of two-pack type comprises (A) a component obtained by mixing an acid anhydride (A1) containing methyltetrahydrophthalic anhydride (A1') and methylhexahydrophthalic anhydride (A1") as essential components with an inorganic filler (A2) containing a spherical silica having ≤2 μm average particle diameter (A2') as an essential component and a curing promoter (A3) and (B) an epoxy resin. Preferably, the component A comprises 10-90 pts.wt. of the component A1" based on 50 pts.wt. of the component A1' and 50-500 pts.wt. of the component A2 and 0.1-10 pts.wt. of the component A3 based on 100 pts.wt. of the component A1.

WO/2023/156255	METHOD FOR PRODUCING A DECORATIVE ELEMENT, WHICH HAS A FUNCTIONAL OPENING, FOR A MOTOR VEHICLE, AND DECORATIVE ELEMENT
JPH068337	MOLDING INTEGRATED WITH POLYURETHANE FOAM AND MANUFACTURE THEREOF

Toshiyuki Fujita
Katsuhiko An
Hiroka Shindo

JP23429697A

June 20, 2007

August 29, 1997

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Hitachi Chemical Co., Ltd.

B29C39/10; C08G59/42; C08K3/00; C08K3/36; C08L63/00; H01B3/40; H01F27/32; H01F41/12; B29K63/00; (IPC1-7): C08L63/00; B29C39/10; C08K3/00; H01B3/40; H01F27/32; H01F41/12; //C08G59/42; B29K63:00

JP4345640A
JP64060625A
JP3157420A

Hiroaki Sakai

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